Amaoe iQ11-012 BGA Reballing Stencil For iQoo 11

Amaoe iQ11-012 BGA Reballing Stencil for iQOO 11 ? High Precision & Superior Durability

Unlock next-level accuracy in mobile chip repair with the Amaoe iQ11-012 BGA Reballing Stencil for iQOO 11. Designed with expert precision for professional technicians, this stencil is your trusted companion for BGA reballing and solder paste application. Whether you’re fixing a damaged chip or reworking the motherboard, this tool ensures clean and controlled solder placement every time.

? Perfect Fit for iQOO 11

This stencil is specially engineered for iQOO 11, ensuring a perfect match with the IC pad layout. The micro-precision apertures align flawlessly with solder pads, making it ideal for critical rework operations on Ball Grid Array (BGA) components.

? Reliable Stainless Steel Build

Crafted from high-grade stainless steel, the Amaoe iQ11-012 BGA Reballing Stencil for iQOO 11 offers durability, heat resistance, and long life. It’s built to withstand repeated use in high-temperature environments without warping or losing form.

? Clean Solder Application

The stencil allows you to apply solder paste or solder balls with precision. Simply align it over the PCB or IC, apply the paste or balls, and you’re ready for soldering. No more messy jobs?just clean, controlled, and professional-grade results.

? Why Choose Amaoe?

Trusted by professionals worldwide, Amaoe delivers unmatched quality and consistency in mobile repairing tools. With the Amaoe iQ11-012 BGA Reballing Stencil for iQOO 11, you’re investing in speed, accuracy, and peace of mind.

Buy now and experience hassle-free reballing and stencil work like never before. This is the tool every technician needs in their workstation.