Description
Amaoe iQ11S-012 BGA Reballing Stencil For iQoo 11S
Amaoe iQ11S-012 BGA Reballing Stencil For iQoo 11S
Take your mobile repair skills to the next level with the Amaoe iQ11S-012 BGA Reballing Stencil for iQoo 11S. Designed for precision and performance, this high-quality stencil is a must-have tool for professional technicians handling BGA chip rework and SMD soldering jobs.
Precision Reballing for iQoo 11S
This BGA reballing stencil for iQoo 11S is engineered with perfect aperture alignment to ensure accurate solder paste or solder ball placement during reballing. Whether you’re replacing or reworking a Ball Grid Array (BGA) chip, this stencil delivers dependable accuracy every time.
Premium Build Quality
Made from high-grade stainless steel, the Amaoe iQ11S-012 stencil withstands high-temperature soldering and repeated use without warping. Its smooth surface and laser-cut holes offer a consistent solder flow for better joint reliability and minimal bridging.
Ideal for SMD and BGA Work
Not only is it perfect for BGA chip reballing, but it’s also suitable for the precise application of solder paste to PCB pads for surface-mount components (SMDs). It’s specially tailored for the component layout of the iQoo 11S, making it an essential tool for targeted repairs.
How to Use
Secure the BGA reballing stencil for iQoo 11S over the chip or PCB, apply solder paste or solder balls, and use gentle heat to reflow. Simple, fast, and highly effective!
Why Choose This Stencil?
-
Compatible with iQoo 11S IC layout
-
Trusted by professional technicians
-
Reusable and durable design
-
Saves time and improves soldering accuracy
Whether you’re working in a repair shop or offering premium rework services, the Amaoe iQ11S-012 BGA reballing stencil for iQoo 11S is the precision tool you can trust for expert-level results.
