BABA LTP-148 Low Temperature Solder Paste 148?C

Description

BABA LTP-148 Low Temperature Solder Paste For IC Reballing Melting Point 148?C

Product Features :-

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• Strong Attachment to the solder joint.??
• Great extensibility after welding.??
• Silver contained with high effect on soldering.??
• Melting Point 148 Degree

  The BABA LTP-148 Low Temperature Solder Paste (148?C) is a high-performance soldering material specially designed for precision electronics repair and low-heat applications. It?s formulated for use in situations where delicate components or heat-sensitive circuits must be soldered without risking thermal damage. With a melting point of approximately 148?C, this solder paste provides exceptional reliability, easy flow, and clean results, making it ideal for mobile repair technicians, PCB assemblers, and electronics engineers.

• Crafted from a premium alloy composition and no-clean flux formula, the BABA LTP-148 ensures consistent soldering results with minimal residue. It offers excellent wetting performance, ensuring that solder flows smoothly across component pads, forming uniform, shiny, and solid joints. The paste adheres firmly and provides strong mechanical and electrical connections, even at lower reflow temperatures.

• Because of its low melting point, the BABA LTP-148 is particularly suitable for repairing mobile motherboards, iPhone and Android logic boards, laptop PCBs, LED circuits, and other compact electronic assemblies. It minimizes heat stress on surrounding components, preventing damage to sensitive chips, plastic connectors, and multilayer boards during rework.

• The smooth, stable consistency of this solder paste ensures easy application using a precision syringe. Each 10cc tube provides ample material for multiple repair projects, whether you?re performing IC reballing, SMD soldering, or small-scale circuit assembly. It?s compatible with hot air rework stations, reflow ovens, and soldering irons, offering flexible use across different repair environments.

• The no-clean, low-residue flux formulation means that after soldering, cleaning is optional. The flux evaporates cleanly, leaving minimal residue and ensuring excellent conductivity. Furthermore, its oxidation-resistant formula enhances reliability, extending the lifespan of both the solder joints and the components.

• Engineered for professionals, the BABA LTP-148 Low Temperature Solder Paste delivers consistent, high-quality results in micro-soldering applications. Whether you?re a mobile repair expert or an electronics hobbyist, it provides the balance of low-heat performance, precision, and strength you need for successful soldering every time.

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• ?? Key Features:

• Type: Low Temperature Solder Paste

• Melting Point: 148?C

• Composition: Refined solder alloy with no-clean flux

• Flux Type: Non-corrosive, low-residue formula

• Form: 10cc syringe paste

• Color: Metallic gray

• Adhesion Strength: Excellent bonding with smooth flow

• Applications: IC reballing, BGA repair, PCB soldering, SMD work, microelectronics