Description
BABA LTP-199 Low Temperature Solder Paste For IC Reballing Melting Point 199?C
Product Features :-
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- Strong Attachment to the solder joint.
- Great extensibility after welding.
- Silver contained with high effect on soldering.
- Melting Point 199 Degree
The BABA LTP-199 High Temperature Solder Paste (199?C) is a premium-quality soldering compound engineered for precision, durability, and reliability in professional electronics repair and manufacturing. Designed for high-temperature applications, this solder paste ensures strong and stable solder joints, making it an essential tool for technicians, engineers, and repair specialists working with mobile motherboards, electronic circuits, and PCB assembly.
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Crafted using refined alloy powder and advanced flux formula, the BABA LTP-199 delivers excellent wetting ability, strong adhesion, and low residue after soldering. With a melting point of approximately 199?C, it is suitable for use in situations requiring superior heat endurance?such as reballing, IC replacement, BGA soldering, and PCB rework.
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Unlike standard low-temperature pastes, this high-temperature formula guarantees better mechanical strength and enhanced joint durability, even under thermal stress or long-term operation. The solder paste maintains its stability during extended heating cycles, ensuring clean and consistent results without splattering, oxidation, or bridging between pads.
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The BABA LTP-199 solder paste comes in a convenient 10cc syringe packaging, making it easy to dispense precisely where needed. It is ideal for use with hot air rework stations, reflow ovens, and soldering irons, depending on your repair workflow. The paste?s smooth consistency ensures even application on small pads, components, and fine-pitch ICs without clogging or uneven spreading.
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This solder paste is formulated with no-clean flux, meaning that after soldering, minimal residue remains, and cleaning is often unnecessary?saving time and preserving sensitive components. Additionally, it offers excellent oxidation resistance, keeping the solder surface bright and ensuring optimal conductivity over time.
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Whether you?re repairing mobile logic boards, reballing BGA chips, or assembling microelectronic circuits, the BABA LTP-199 High Temperature Solder Paste provides the perfect combination of heat tolerance, strength, and precision.
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?? Key Features:
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Type: High Temperature Solder Paste
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Melting Point: 199?C
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Composition: High-purity alloy with no-clean flux
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Flux Type: Non-corrosive, low residue
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Form: Paste (10cc syringe)
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Color: Metallic gray
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Adhesion: Strong and stable bonding
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Applications: IC reballing, BGA soldering, PCB repair, and high-temp component assembly
