Description
ChipQuik LT4258HX50T3 is a high-performance, lead-free, no-clean solder paste designed for precision electronics assembly and rework
Product Featutres :-
- Low Melting Point: Melts at 138°C (281°F), reducing the risk of thermal damage to delicate components.
- Alloy Composition: Sn42/Bi58. offering excellent wetting and joint strength.
- Flux Type: Synthetic No-Clean (REL0), leaving minimal residue and eliminating the need for post-solder cleaning.
- Particle Size: T3 mesh (25–45 µm), suitable for fine-pitch components and precise applications.
- Metal Content: 90% by weight, ensuring consistent solder joints.
- Packaging: Available in a 50g.
