Description
Jitongxue Hisilicon Series Green Oil UV Stencil BGA IC Reballing Stencil
Product Features :-
- Designed for HiSilicon series BGA IC reballing
- Made with high-quality green oil UV stencil material
- Provides accurate solder ball positioning
- Suitable for BGA chip repair and reballing
- Helps achieve consistent and uniform solder paste application
- Durable and reusable for multiple reballing jobs
- Precise stencil openings for reliable alignment
- Easy to use with standard BGA reballing tools
- Ideal for mobile phones, tablets, and electronic device repair
- Compact design for convenient storage and handling
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