Description
JTx T4 Universal Chips Glue Removal And IC Reballing Platform For iPhone Android CPU EMMC Ram 76 Models of Chips With 13 Stencil
Product Features :-
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- T4 degumming and tin planting platform, support Apple/Huawei /OPPO/vivo/Honor/Xiaomi/Samsung and other models a total of 76 models of chips
- The 2-in-1 design greatly helps the maintenance master to save costs and plant tin efficiency
- Magnetic automatic clamping, universal 3D planting tin net, removing the glue card, precise positioning
- Clamping precision, more stable operation, not easy to damage the chip
- Using a new type of magnetic dynamic positioning, strong magnetic clamping stable, automatic alignment
- It has wear-resistant, anti-slip, shock-absorbing, anti-aging, non-toxic tasteless and high-temperature resistance
- Selected high-quality steel, fine workmanship, wear resistance, high toughness support tin planting
- Support unlimited expansion, a total of 76 types of chips
