Description
KOOCU Advanced BGA Paste Alloy 63Sn/37Pb (30gm)
KOOCU Advanced BGA Paste Alloy 63Sn/37Pb (30gm) ? High-Quality Soldering Solution for Professionals
The KOOCU Advanced BGA Paste Alloy 63Sn/37Pb (30gm) is a premium-grade soldering paste designed for high-precision motherboard repairs and professional-grade electronic applications. This advanced BGA (Ball Grid Array) paste offers exceptional adhesion, smooth application, and strong solder joints, making it the ideal choice for mobile repair technicians, laptop service professionals, and electronic enthusiasts.
Formulated with a 63% Tin (Sn) and 37% Lead (Pb) alloy composition, this paste ensures excellent conductivity, low melting point (183?C), and superior mechanical strength. It minimizes soldering defects like bridging and voids, providing a stable and durable connection for IC chips, BGA rework, and SMD components.
? High Purity Composition ? Ensures consistent and reliable soldering.
? Enhanced Wetting Ability ? Provides smooth and uniform application.
? Low Oxidation & Long Shelf Life ? Stays effective for extended periods.
? Trusted by Professionals ? Preferred by expert mobile and PCB repairers.
- Clean the soldering area thoroughly.
- Apply a small amount of BGA paste to the required surface.
- Heat using a rework station or hot air gun until soldering is complete.
Buy with confidence ? KOOCU guarantees premium quality, precision, and durability for every repair task.
