Description

Mechanic Intelligent iT3 Pro Preheating Platform For iPhone X-16PM Motherboard Layered/IC Chip BGA Stencil/Dot Matrix Repair Tools
Product Features :-
  • Layering, tin planting, bonding, desoldering, and glue removal are integrated, and it is equipped with controllable temperature / module expansion design / no air gun and no soldering iron I plug and play technology
  • Intelligent adjustable temperature, custom debugging temperature, debugging temperature according to different melting points
  • No air gun, no soldering iron, fast and accurate layered tin planting in 3 minutes to fit the motherboard
  • Modular design, multiple combination modules, good scalability, easy to expand new modules
  • Plug and play technology, the device supports hot swap, making your work more efficient
  • Scope of application: latest support for IP X/XS/XS Max 11/11 Pro/11 Pro Max 12 mini/12/12 Pro/12 Pro Max 13/13mini/13 Pro/13Pro 14/14mini/14 Pro/14Pro Max 15/15Plus/15Pro/15Pro Max 16/16Plus/16Pro/16Pro Max motherboard layering. Fitting. Dot matrix repair

Additional information

Weight 0.25 kg

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