Description
Mechanic XG50 Solder Paste 183?C Degree Melting Point For SMD Rework BGA IC Reballing Paste
Product Features :-
- Melting point: 183?C
- Suitable for SMD, BGA, and IC reballing
- Sn63/Pb37 alloy composition
- Good viscosity for smooth application
- Strong adhesion for reliable solder joints
- Easy to use and clean
- Stable performance for rework and repair
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