Description
Amaoe IPBB1 BGA Reballing Stencil
The Amaoe U-IPBB1 BGA Reballing Stencil 2 is a professional-grade, ultra-precise stencil engineered for reballing, soldering, and IC chip repair on Apple IPBB1 chips used in iPhone logic boards. Part of Amaoe?s premium U-Series, this stencil delivers accuracy, stability, and durability, making it a top choice for professional mobile repair technicians, microsoldering engineers, and IC-level repair specialists.
Using advanced laser-cut technology, the U-IPBB1 ensures perfect solder ball placement, uniform reflow, and minimal bridging risk during chip reballing. Its stainless steel construction offers excellent heat resistance, corrosion protection, and long-term reuse, providing consistent professional results for CPU, NAND, PMIC, or communication chip rework.
?? Key Features
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Model: Amaoe U-IPBB1 BGA Reballing Stencil 2
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Brand: Amaoe
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Compatibility: Designed for Apple IPBB1 IC chips (used in iPhone 12, 13, and 14 series logic boards)
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Material: High-quality stainless steel
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Thickness: 0.12mm
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Hole Precision: ?0.01mm laser-cut accuracy
aser-Cut Precision: Ensures accurate solder ball alignment for professional reballing.
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Anti-Warp Design: Maintains flatness under high heat, up to 500?C.
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Durable Stainless Steel: Resists deformation and ensures long-term usage.
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Professional-Grade Tool: Ideal for certified repair technicians and mobile repair labs.
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Easy Cleaning: Smooth surface allows quick cleaning with isopropyl alcohol.
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Reusable: Built to withstand hundreds of reballing cycles.
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Lead-Free Compatible: Supports both leaded and lead-free solder applications.
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Anti-Oxidation Coating: Prevents corrosion and extends service life.
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Even Heat Distribution: Guarantees uniform solder reflow during BGA rework.
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Optimized for IC Repairs: Suitable for CPU, NAND, PMIC, and baseband chips.
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Stencil Type: Direct heat / flat stencil
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Surface Treatment: Anti-oxidation coating to prevent corrosion and wear
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Heat Resistance: Up to 500?C
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Use Case: IC chip reballing, solder paste printing, CPU/NAND/PMIC rework
