Amaoe U-APHD1 BGA Reballing Stencil

Description

Amaoe U-APHD1 BGA Reballing Stencil
The Amaoe U-APHD1 BGA Reballing Stencil 3 is a professional reballing stencil designed for high-precision IC chip soldering, reballing, and rework of Apple devices. Part of Amaoe?s flagship U-Series, this stencil is engineered using ultra-fine laser-cutting technology to deliver exceptional accuracy, stability, and durability?making it the ideal tool for professional iPhone motherboard repair technicians and IC-level engineers.

Crafted from premium stainless steel, the U-APHD1 ensures perfect solder ball alignment during reballing and provides consistent results even under repeated high-temperature cycles. It?s designed to support Apple APHD1 chipsets?typically found in the latest iPhone series and logic board modules?making it an essential tool for precision IC chip rework and logic board maintenance.

?? Key Features

• Model: Amaoe U-APHD1 BGA Reballing Stencil 3

• Brand: Amaoe

• Compatibility: Specifically designed for Apple APHD1 IC chips (used in iPhone 14/15 Pro models and newer A-series processors)

• Material: Industrial-grade stainless steel

• Thickness: 0.12mm

• Hole Accuracy: ?0.01mm for precise solder ball positioning

• Type: Flat stencil / Direct heat design

• Surface Treatment: Anti-oxidation coating to prevent rust and wear

• Heat Resistance: Up to 500?C without deformation

• Manufacturing Process: CNC laser micro-cutting for fine-pitch solder pads

• Application: Reballing, IC chip repair, CPU/NAND/PMIC solder rework

?? Technical Specifications

?? Product Highlights

1. High Precision Alignment: Each opening is laser-cut for exact solder ball placement and uniform heating.

2. Anti-Warp Construction: Maintains perfect flatness during high-temperature reflow.

3. Excellent Heat Conductivity: Ensures even solder paste melting during hot air or IR heating.

4. Durable Build: Stainless steel construction ensures longevity and reusability.

5. Anti-Oxidation Surface: Prevents corrosion and extends operational life.

6. Professional-Grade Design: Developed for advanced BGA rework and chip-level technicians.

7. Easy to Clean: Smooth finish resists solder residue buildup for quick maintenance.

8. Lead-Free Compatible: Works with both leaded and lead-free solder balls.

9. Reusable: Can be used multiple times without losing shape or alignment precision.

10. Precision Performance: Delivers consistent results in every reballing cycle.