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Amaoe U-MT6985 BGA Reballing Stencil

Original price was: ₹420.00.Current price is: ₹145.95.

Amaoe U-MT6985 BGA Reballing Stencil

18 in stock

Description

Amaoe U-MT6985 BGA Reballing Stencil

The Amaoe U-MT6985 BGA Reballing Stencil 3 is a high-precision, professional-grade stencil designed specifically for Apple MT6985 processor chips (found in iPhone 15 and other high-end Apple devices). It is part of Amaoe?s premium reballing tool lineup, trusted by professional repair technicians for IC chip soldering, reballing, and rework applications.

Engineered with ultra-fine laser-cut accuracy, this stencil provides unmatched consistency and alignment during BGA reballing, ensuring that every solder ball is placed with perfect precision. Whether you?re repairing logic boards, replacing CPU or baseband chips, or conducting microsoldering training, the Amaoe U-MT6985 Stencil delivers the stability, reliability, and durability you need.


Key Features

  • Model: Amaoe U-MT6985 BGA Reballing Stencil 3

  • Compatibility: Specifically designed for Apple MT6985 chip (A17 Pro processor, iPhone 15/15 Pro series).

  • Material: High-quality stainless steel with precise laser cutting for durability and heat resistance.

  • Thickness: 0.12mm (optimized for accurate solder paste deposition).

  • Stencil Type: Direct heating / reballing stencil (non-shrink, anti-warp design).

  • Usage: For reballing, solder paste printing, and IC chip positioning.

  • Surface Finish: Anti-oxidation treatment to prevent corrosion and extend life span.

  • Precision Level: ?0.01mm hole tolerance for perfect solder ball alignment.

  • Heat Resistance: Withstands up to 500?C without deformation.

  • Application: Ideal for logic board repair, CPU/GPU reballing, and advanced microsoldering.

  • Brand Origin: Amaoe, a leading manufacturer of BGA repair tools and reballing accessories.


Product Advantages

  1. High Precision Alignment: Laser-cut holes ensure exact ball placement with no bridging or misalignment.

  2. Durability: The robust stainless steel construction maintains shape even after multiple reballing cycles.

  3. Anti-Warp Technology: Designed to resist warping during heating, ensuring consistent contact with IC chips.

  4. Easy to Clean: Smooth, corrosion-resistant surface for effortless cleaning and maintenance.

  5. Professional-Grade Performance: Perfect for technicians, repair shops, and rework laboratories handling advanced IC repairs.

  6. Efficient Heat Transfer: Optimized metal composition allows even heating during hot air or infrared reflow.

  7. Long Lifespan: Engineered for repeated use without losing structural integrity or accuracy.

Additional information

Weight 0.05 kg
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Amaoe U-MT6985 BGA Reballing Stencil
Original price was: ₹420.00.Current price is: ₹145.95.

18 in stock